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INTEGRATED CIRCUITS
DATA SHEET
TDA8579 Dual common-mode rejection differential line receiver
Product specification Supersedes data of January 1994 File under Integrated Circuits, IC01 1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
FEATURES * Excellent common-mode rejection, up to high frequencies * Elimination of source resistance dependency in the common-mode rejection * Few external components * High supply voltage ripple rejection * Low noise * Low distortion * All pins protected against electrostatic discharge * AC and DC short-circuit safe to ground and VCC * Fast DC settling. QUICK REFERENCE DATA SYMBOL VCC ICC Gv SVRR Vno Zi CMRR PARAMETER supply voltage supply current voltage gain supply voltage ripple rejection noise output voltage input impedance common-mode rejection ratio Rs = 0 VCC = 8.5 V CONDITIONS - -0.5 55 - 100 - MIN. 5.0 11 0 60 3.7 240 80 TYP. 8.5 GENERAL DESCRIPTION
TDA8579
The TDA8579 is a two channel differential amplifier with 0 dB gain and low distortion. The device has been primarily developed for car radio applications where long connections between signal sources and amplifiers (or boosters) are necessary and where ground noise has to be eliminated. The device is intended to be used to receive line inputs in audio applications that require a high level of common-mode rejection. The device is contained in an 8-pin small outline (SO) or dual in-line (DIP) package.
MAX. 18 14 +0.5 - 5.0 - - V
UNIT mA dB dB V k dB
ORDERING INFORMATION TYPE NUMBER TDA8579 TDA8579T PACKAGE NAME DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT97-1 SOT96-1
1995 Dec 15
2
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
BLOCK DIAGRAM
VCC 8 INL 1 7 VCC 2 4 OUTL
TDA8579
FUNCTIONAL DESCRIPTION The TDA8579 contains two identical differential amplifiers with a voltage gain of 0 dB. The device is intended to receive line input signals for audio applications. The TDA8579 has a very high level of common-mode rejection and thus eliminates ground noise. The common-mode rejection remains constant up to high frequencies (the amplifier gain is fixed at 0 dB). The inputs have a high input impedance. The output stage is a class AB stage with a low output impedance. For a large common-mode rejection, also at low frequencies, an electrolytic capacitor connected to the negative input is advised. Because the input impedance is relatively high, this results in a large settling time of the DC input voltage. Therefore a quick-charge circuit is included to charge the input capacitor within 0.2 seconds. All input and output pins are protected against high electrostatic discharge conditions (4000 V, 150 pF, 150 ).
IN
TDA8579
SVRR
6 INR 3 5
MBD230
OUTR
GND
Fig.1 Block diagram.
PINNING SYMBOL INL+ IN- INR+ SVRR GND OUTR OUTL VCC PIN 1 2 3 4 5 6 7 8 DESCRIPTION positive input left common negative input positive input right half supply voltage ground output right output left supply voltage
INL IN INR SVRR 1 2 TDA8579 3 4
MBD231
8 7 6 5
V CC OUTL OUTR GND
Fig.2 Pin configuration.
1995 Dec 15
3
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
LIMITING VALUES in accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC IORM Vsc Tstg Tamb Tj supply voltage repetitive peak output current AC and DC short-circuit safe voltage storage temperature operating ambient temperature maximum junction temperature PARAMETER CONDITIONS operating - - - -55 -40 - MIN.
TDA8579
MAX. 18 40 18 +150 +85 +150 V
UNIT mA V C C C
THERMAL CHARACTERISTICS SYMBOL Rth j-a TDA8579 (DIP8) TDA8579T (SO8) PARAMETER thermal resistance from junction to ambient in free air 110 160 K/W K/W VALUE UNIT
1995 Dec 15
4
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
CHARACTERISTICS VCC = 8.5 V; Tamb = 25 C; f = 1 kHz; measured in test circuit of Fig.3; unless otherwise specified. SYMBOL VCC ICC VO tset Gv cs Gv fL fH Zi Zo Vi(max) Vno VCM(rms) CMRR SVRR THD PARAMETER supply voltage supply current DC output voltage DC input voltage settling time voltage gain channel separation channel unbalance low frequency roll-off high frequency roll-off input impedance output impedance maximum input voltage noise output voltage common-mode input voltage (RMS value) common-mode rejection ratio supply voltage ripple rejection total harmonic distortion Rs = 5 k Rs = 0 ; note 4 note 5 note 6 Vi = 1 V; Vi = 1 V; f = 20 Hz to 20 kHz THDmax Notes 1. The DC output voltage with respect to ground is approximately 0.5VCC. 2. The frequency response is externally fixed by the input coupling capacitors. 3. The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted). total harmonic distortion at maximum output current Vi = 1 V; RL = 150 THD = 1% Rs = 0 ; note 3 -1 dB; note 2 -1 dB Rs = 5 k note 1 CONDITIONS - - - -0.5 70 - 20 20 100 - - - - 66 - 55 - - - - MIN. 5.0 TYP. 8.5 11 4.3 0.2 0 80 - - - 240 - 2.0 3.7 - 70 80 65 60 0.02 - -
TDA8579
MAX. 18 14 - - +0.5 - 0.5 - - - 10 - 5.0 1.0 - - - - - 0.1 1 V
UNIT mA V s dB dB dB Hz kHz k V V V dB dB dB dB % % %
4. The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in accordance with the test circuit (see Fig.3) while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz. 5. The ripple rejection is measured at the output, with Rs = 2 k, f = 1 kHz and a ripple amplitude of 2 V (p-p). 6. The ripple rejection is measured at the output, with Rs = 0 to 2 k, f = 100 Hz to 20 kHz and a maximum ripple amplitude of 2 V (p-p).
1995 Dec 15
5
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8579
8.5 V Rs V INL 5 k 220 nF 8 1 7 VCC 22 F 2 2.2 F OUTL 100 nF
TDA8579
SVRR 4
47 F
V CM
V INR 6 Rs 5 k 220 nF 3 5
2.2 F OUTR RL 10 k RL 10 k
MBD232
Fig.3 Test and application circuit.
10 1
MBD215
THD (%)
10 2
10
3
10
10 2
10 3
10 4
f (Hz)
10 5
Fig.4 Total harmonic distortion as a function of frequency; Vi = 1 V (RMS). 1995 Dec 15 6
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8579
MBD216
0 CMR (dB) 20
40
(1) 60 (2) 80 (3) 100 10 (1) Rs = 5 k. (2) Rs = 2 k. (3) Rs = 0 k.
10 2
10 3
10 4
f (Hz)
10 5
Fig.5 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS).
1
MBD213
THD (%)
10 1
10
2
10 3 10
10 2
10 3
V i (rms) (mV)
10 4
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
1995 Dec 15
7
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8579
MBD214
40 CMR (dB) 50
60
70
80
90 100
300
500
700
900
1100
V CM (rms) (mV)
1300
Fig.7 Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz (Rs = 0 ).
MBD211
0 CMR (dB) 20
40
60
(1) (2) (3)
80
100 10 (1) C2 = 22 F. (2) C2 = 47 F. (3) C2 = 100 F.
10 2
10 3
10 4
f (Hz)
10 5
Fig.8 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS). 1995 Dec 15 8
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8579
30 SVR (dB) 40
MBD212
50
60
70 10
10 2
10 3
f (Hz)
10 4
Fig.9 Supply voltage ripple rejection as a function of frequency; Vripple = 2 V (p-p), Rs = 2 k.
1995 Dec 15
9
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA8579
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1995 Dec 15
10
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8579
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-05-22
1995 Dec 15
11
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8579
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1995 Dec 15
12
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8579
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Dec 15
13

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